CVE-2026-21385

Qualcomm Multiple Chipsets Memory Corruption Vulnerability

Sm7675P Firmware

Memory corruption while using alignments for memory allocation.

2. Mär 2026

Ausgewertete Quellen

• Android
  https://source.android.com/docs/security/bulletin/2026/2026-03-01
• Hersteller
  https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2026-bulletin.html
• CISA
  https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2026-21385
• CISA
  Qualcomm Multiple Chipsets Memory Corruption Vulnerability
• NVD
  CVE-2026-21385