CVE-2024-43047

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Fastconnect 6700 Firmware

Memory corruption while maintaining memory maps of HLOS memory.

7. Okt 2024

Ausgewertete Quellen

• Hersteller
  https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html
• CISA
  https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2024-43047
• CISA
  Qualcomm Multiple Chipsets Use-After-Free Vulnerability
• NVD
  CVE-2024-43047