CVE-2023-33063

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

315 5G Iot Modem Firmware

Memory corruption in DSP Services during a remote call from HLOS to DSP.

5. Dez 2023

Ausgewertete Quellen

• Hersteller
  https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
• CISA
  https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2023-33063
• CISA
  Qualcomm Multiple Chipsets Use-After-Free Vulnerability
• NVD
  CVE-2023-33063