CVE-2022-22071
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Apq8053 Firmware
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
14. Jun 2022
Original bei Hersteller öffnenAusgewertete Quellen
- Herstellerhttps://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin
- CISAhttps://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2022-22071
- CISAQualcomm Multiple Chipsets Use-After-Free Vulnerability
- NVDCVE-2022-22071